Computing is no longer about the traditional PC, said Intel President Renée James during Computex Taipei, which runs from June 3 to June 7 in Taiwan, and a major show on the annual industry show circuit.
According to James, Intel and the Taiwan technology ecosystem have the exciting opportunity to collaborate to deliver seamless and truly personal computing experiences.
“The lines between technology categories are blurring as the era of integrated computing takes hold where form factor matters less than the experience delivered when all devices are connected to each other and to the cloud,” said James. “Whether it’s a smartphone, smart shirt, ultra-thin 2 in 1 or a new cloud service delivered to smart buildings outfitted with connected systems, together Intel and the Taiwan ecosystem have the opportunity to accelerate and deliver the value of a smart, seamlessly connected and integrated world of computing.”
James noted that Intel currently has 130 tablet design wins that are either in market or will be in market this year, from global OEMs and ODMs. More than a dozen Intel-based tablets are launching in the Computex timeframe. Approximately 35% of Intel Atom processor-based tablet designs currently include or will include Intel communications solutions, she said.
Foxconn executive Young Liu joined James on stage to showcase more than 10 Intel-based tablets available now or coming soon, ranging from the entry to performance segments. The tablets are based on Intel Atom processors (codenamed Bay Trail or Clovertrail+) SoCs. Many included Intel’s 3G or LTE communications platforms.
James also said the category 6-capable Intel XMM 7260 LTE-Advanced platform is now shipping to customers for interoperability testing and said this puts Intel into a leadership position. This new technology is expected to appear in devices in the coming months.
Noting progress toward bringing the company’s first integrated mobile SoC platform for entry and value smartphones and tablets to market in the fourth quarter of this year, James made the first public phone call using a smartphone reference design based on the dual-core Intel SoFIA 3G solution. Intel will also bring a quad-core SoFIA LTE part to market in the first half of 2015 and last week announced an agreement with Rockchip to add a quad-core SoFIA 3G derivative for entry-level tablets to the SoFIA family, also due in the first half of next year.
James also revealed the world’s first 14nm fanless mobile PC reference design from Intel. The 2 in 1 is a 12.5-inch screen that is 7.2mm thin with keyboard detached and weighs 670 grams. It includes a media dock that provides additional cooling for a burst of performance. The innovative design is based on the first of Intel’s next-generation 14nm Broadwell processors that are purpose-built for 2 in 1s and will be in market later this year. Called the Intel Core M processor, it will deliver the most energy-efficient Intel Core processor in the company’s history1. The majority of designs based on this new chip are expected to be fanless and deliver both a fast tablet and thin laptop.
Intel is also delivering innovation and performance for the most demanding PC users with the 4th generation Intel Core i7 and i5 processor “K” SKU, the first from Intel to deliver four cores at up to 4 GHz base frequency. This desktop processor provides higher performance